This year, our colleagues Safia, Antoine, and Quentin represented EHP at the ESTEW Conference hosted by the European Space Agency (ESA). They unveiled a suite of next‑generation aerospace technologies that push the boundaries of thermal control.
From flexible heat pipes, to high power density electronics cooling, to low-temperature (100°K) thermal control, these developments promise to accelerate mission timelines while reducing cost and risk. The enthusiastic response from industry peers and ESA officials underscores the relevance of our work.
Stay tuned for more updates as we move these concepts from prototype to flight‑ready hardware. Together, we’re turning bold ideas into reality – one launch at a time.
Comments are closed